METHOD FOR MANUFACTURING SUBSTRATE TERMINAL BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

• Main Authors: YUASA MAMORU, WAKABAYASHI SHOJIRO, NAKAGAWA MASAYA, WATANABE TOSHIFUMI
• Format: Patent
• Language: English; Japanese
• Published: 24.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To make it possible to supply electricity to a semiconductor element side without using a plurality of independent parts and to provide an easy-to-handle substrate terminal board for mounting a semiconductor element.SOLUTION: Formed is one semiconductor element mounting substrate terminal board 1, in which a lower substrate 2 and an upper substrate 3 are connected by bonding resin coating films 7 of the lower substrate 2 and the upper substrate 3 to each other, having an element mounting portion 4 including a first element connecting terminal part 8 and a second element connecting terminal part 13 and having an electrode terminal portion 5 in which a first electrode terminal portion 9 and a second electrode terminal portion 14 each of which has an electrode line constraint portion 10 arranged in the vicinity of the same are arranged.SELECTED DRAWING: Figure 1 【課題】複数の独立した部品を用いることなしに半導体素子側への電気の供給が行えるようにし、半導体素子取付用の取り扱い容易な基板端子板を提供する。【解決手段】下基板２と上基板３との樹脂被覆膜７相互の接着にて下基板２と上基板３とを連結し、第一素子接続端子部８と第二素子接続端子部１３とを備えた素子取付部４を有するとともに、それぞれが電極線拘束部１０を近傍に配した第一電極端子部９と第二電極端子部１４とを配した電極端子部５を有する一つの半導体素子取付用基板端子板１を形成する。【選択図】図１