METHOD FOR MANUFACTURING SUBSTRATE TERMINAL BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
PROBLEM TO BE SOLVED: To make it possible to supply electricity to a semiconductor element side without using a plurality of independent parts and to provide an easy-to-handle substrate terminal board for mounting a semiconductor element.SOLUTION: Formed is one semiconductor element mounting substra...
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Language | English Japanese |
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24.05.2018
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Abstract | PROBLEM TO BE SOLVED: To make it possible to supply electricity to a semiconductor element side without using a plurality of independent parts and to provide an easy-to-handle substrate terminal board for mounting a semiconductor element.SOLUTION: Formed is one semiconductor element mounting substrate terminal board 1, in which a lower substrate 2 and an upper substrate 3 are connected by bonding resin coating films 7 of the lower substrate 2 and the upper substrate 3 to each other, having an element mounting portion 4 including a first element connecting terminal part 8 and a second element connecting terminal part 13 and having an electrode terminal portion 5 in which a first electrode terminal portion 9 and a second electrode terminal portion 14 each of which has an electrode line constraint portion 10 arranged in the vicinity of the same are arranged.SELECTED DRAWING: Figure 1
【課題】複数の独立した部品を用いることなしに半導体素子側への電気の供給が行えるようにし、半導体素子取付用の取り扱い容易な基板端子板を提供する。【解決手段】下基板2と上基板3との樹脂被覆膜7相互の接着にて下基板2と上基板3とを連結し、第一素子接続端子部8と第二素子接続端子部13とを備えた素子取付部4を有するとともに、それぞれが電極線拘束部10を近傍に配した第一電極端子部9と第二電極端子部14とを配した電極端子部5を有する一つの半導体素子取付用基板端子板1を形成する。【選択図】図1 |
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AbstractList | PROBLEM TO BE SOLVED: To make it possible to supply electricity to a semiconductor element side without using a plurality of independent parts and to provide an easy-to-handle substrate terminal board for mounting a semiconductor element.SOLUTION: Formed is one semiconductor element mounting substrate terminal board 1, in which a lower substrate 2 and an upper substrate 3 are connected by bonding resin coating films 7 of the lower substrate 2 and the upper substrate 3 to each other, having an element mounting portion 4 including a first element connecting terminal part 8 and a second element connecting terminal part 13 and having an electrode terminal portion 5 in which a first electrode terminal portion 9 and a second electrode terminal portion 14 each of which has an electrode line constraint portion 10 arranged in the vicinity of the same are arranged.SELECTED DRAWING: Figure 1
【課題】複数の独立した部品を用いることなしに半導体素子側への電気の供給が行えるようにし、半導体素子取付用の取り扱い容易な基板端子板を提供する。【解決手段】下基板2と上基板3との樹脂被覆膜7相互の接着にて下基板2と上基板3とを連結し、第一素子接続端子部8と第二素子接続端子部13とを備えた素子取付部4を有するとともに、それぞれが電極線拘束部10を近傍に配した第一電極端子部9と第二電極端子部14とを配した電極端子部5を有する一つの半導体素子取付用基板端子板1を形成する。【選択図】図1 |
Author | WATANABE TOSHIFUMI NAKAGAWA MASAYA WAKABAYASHI SHOJIRO YUASA MAMORU |
Author_xml | – fullname: YUASA MAMORU – fullname: WAKABAYASHI SHOJIRO – fullname: NAKAGAWA MASAYA – fullname: WATANABE TOSHIFUMI |
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DocumentTitleAlternate | 半導体素子取付用基板端子板の製造方法 |
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RelatedCompanies | STANLEY ELECTRIC CO LTD SUNCALL CORP |
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Snippet | PROBLEM TO BE SOLVED: To make it possible to supply electricity to a semiconductor element side without using a plurality of independent parts and to provide... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | METHOD FOR MANUFACTURING SUBSTRATE TERMINAL BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT |
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