COATING FILM FORMATION DEVICE, COATING FILM FORMATION METHOD AND STORAGE MEDIUM

• Main Author: SATO YOSHITOMO
• Format: Patent
• Language: English; Japanese
• Published: 24.05.2018
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a technique which allows for quick formation of a good coating film by making a coating liquid reach a concave pattern, when forming the coating film by a high viscosity coating liquid for a substrate having the concave pattern formed on the surface.SOLUTION: A coating film formation device includes a substrate holding section 21 for holding a substrate W horizontally, a surface treatment liquid supply nozzle supplying a surface treatment liquid for increasing wettability to a coating liquid on the surface of the substrate W to the surface of the substrate W, a press part 41 for pressing the surface treatment liquid, supplied to the surface of the substrate W, against the surface of the substrate W and supplying into the concave pattern, by moving in the horizontal direction relatively to the substrate W in close proximity to the surface of the substrate W, and a coating liquid supply nozzle 31 for supplying the coating liquid to the surface of the substrate W after the surface treatment liquid was pressed by the press part 41.SELECTED DRAWING: Figure 10 【課題】表面に凹形パターンが形成された基板に対して高粘度の塗布液により塗布膜を形成するにあたり、塗布液が凹形パターン内まで行き渡って、良好な塗布膜を速やかに形成することができる技術を提供すること。【解決手段】基板Ｗを水平に保持する基板保持部２１と、基板Ｗの表面における前記塗布液に対する濡れ性を高めるための表面処理液を当該基板Ｗの表面に供給する表面処理液供給ノズルと、前記基板Ｗの表面に近接した状態で当該基板Ｗに対して水平方向に相対的に移動することで、前記基板Ｗの表面に供給された前記表面処理液を当該基板Ｗの表面に押し付けて前記凹形パターン内に供給するための押し付け部４１と、前記押し付け部４１による前記表面処理液の押し付け後に当該基板Ｗの表面に前記塗布液を供給する塗布液供給ノズル３１と、を備えるように装置を構成する。【選択図】図１０