METHOD FOR REGENERATING COMPONENT FOR SEMICONDUCTOR MANUFACTURING, REGENERATION DEVICE THEREOF, AND REGENERATION COMPONENT

• Main Authors: HONG WON-PYO, YUN JONG SUNG, KIM KI WON, ROH HYEONG UK
• Format: Patent
• Language: English; Japanese
• Published: 30.11.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a method for regenerating a component for a semiconductor manufacturing, a regeneration device thereof, and a regeneration component.SOLUTION: According to one embodiment, there is provided a method for regenerating a component for semiconductor manufacturing. The method includes: a preparing step of preparing a damaged component for semiconductor manufacturing; a first cleaning step of cleaning the damaged component for semiconductor manufacturing; a masking step of masking at least one of regions containing undamaged portions of the component for semiconductor manufacturing; a regeneration part forming step of forming a regeneration part on the damaged component for semiconductor manufacturing by a chemical vapor deposition method; a post-processing step of processing the damaged component for semiconductor manufacturing in which the regeneration part is formed; and a second cleaning step of cleaning the damaged component for semiconductor manufacturing in which the regeneration part is formed.SELECTED DRAWING: Figure 4 【課題】本発明は、半導体製造用部品の再生方法とその再生装置、及び再生部品を提供する【解決手段】本発明の一実施形態によれば、損傷した半導体製造用部品を備える準備ステップと、前記損傷した半導体製造用部品を洗浄する第１洗浄ステップと、前記損傷した半導体製造用部品の非損傷の部分を含む領域のうち少なくともいずれか１つをマスキングするマスキングステップと、前記損傷した半導体製造用部品に化学気相蒸着法で再生部を形成する再生部形成ステップと、前記再生部が形成された損傷した半導体製造用部品を加工する後加工ステップと、前記再生部が形成された損傷した半導体製造用部品を洗浄する第２洗浄ステップと、を含む、半導体製造用部品の再生方法が提供される。【選択図】図４