SOLDER COMPOSITION FOR SOLDER BUMP FORMATION AND METHOD FOR FORMING SOLDER BUMP

• Main Authors: MIURA HIROSHI, EIZAI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder composition for solder bump formation which can satisfactorily suppress non-wetting of a solder bump.SOLUTION: There is provided a solder composition for solder bump formation which contains a flux composition containing (A) a binder and (B) an activator, and (C) solder powder, where (A) the binder contains at least one selected from the group consisting of (A1) an epoxy compound and (A2) an acrylic compound, and (B) the activator contains (B1) organic acid amine salt.SELECTED DRAWING: None 【課題】はんだバンプの不濡れを十分に抑制できるはんだバンプ形成用はんだ組成物を提供すること。【解決手段】本発明のはんだバンプ形成用はんだ組成物は、（Ａ）バインダーおよび（Ｂ）活性剤を含有するフラックス組成物と、（Ｃ）はんだ粉末とを含有し、前記（Ａ）バインダーが、（Ａ１）エポキシ化合物および（Ａ２）アクリル化合物からなる群から選択される少なくとも１種を含有し、前記（Ｂ）活性剤が、（Ｂ１）有機酸アミン塩を含有することを特徴とするものである。【選択図】なし