SEMICONDUCTOR DEVICE, SOLID IMAGING DEVICE, AND ELECTRONIC APPARATUS

• Main Authors: HONGO KAZUYASU, MADA YUSUKE
• Format: Patent
• Language: English; Japanese
• Published: 28.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To suppress the warpage.SOLUTION: In a mount board, a solid imaging device has a light reception surface to which a subject image is incident. By connecting a solder ball, which is disposed on a back surface of the light reception surface, to a wiring board, an electric signal can be extracted to the outside and can be recognized as an image. On a side opposite to the solid imaging device mounted on the wiring board, a thermal expansion adjusting member is provided. The thermal expansion adjusting member has the linear expansion coefficient and the Young's modulus adjusted so that the solid imaging device side and the thermal expansion adjusting member side have the equal or substantially equal rigidity. The present disclosure is applicable to, for example, a CMOS solid imaging device to be used for the imaging device such as a camera.SELECTED DRAWING: Figure 4 【課題】反りを抑えることができる。【解決手段】実装基板において、固体撮像装置は被写体像が入射される受光面を有し、受光面裏面に配置されるはんだボールを配線基板と接続することで、電気信号を外部に取り出し、画像として認識することを可能とする。また、配線基板の上に実装された固体撮像装置とは反対側に、熱膨張調整部材が設けられている。この熱膨張調整部材は、線膨張係数とヤング率が調整されており、固体撮像装置側と熱膨張調整部材側で剛性が、等しい、または、ほぼ同等になるようになっている。本開示は、例えば、カメラなどの撮像装置に用いられるCMOS固体撮像装置に適用することができる。【選択図】図４