PIEZOELECTRIC DEVICE
PROBLEM TO BE SOLVED: To provide a piezoelectric device which is formed at a wafer level to enable cost reduction and achieves excellent vibration characteristics.SOLUTION: A piezoelectric device includes: a piezoelectric vibration piece 110 having a vibration part 110b which is thin compared to a p...
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| Format | Patent |
| Language | English Japanese |
| Published |
14.09.2017
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To provide a piezoelectric device which is formed at a wafer level to enable cost reduction and achieves excellent vibration characteristics.SOLUTION: A piezoelectric device includes: a piezoelectric vibration piece 110 having a vibration part 110b which is thin compared to a periphery part 110a; intermediate films 120, 130 which are formed on a front surface and a rear surface of the piezoelectric vibration piece 110 and are joined to the periphery part 110a while separated from the vibration part 110b; and sealing films 140, 150 formed on surfaces of the intermediate films 120, 130 and laminated on the intermediate films 120, 130.SELECTED DRAWING: Figure 1
【課題】ウェハレベルで作成されることにより低コスト化を可能にするとともに、振動特性が優れた圧電デバイスを提供する。【解決手段】周辺部１１０ａに対して薄肉の振動部１１０ｂを有する圧電振動片１１０と、圧電振動片１１０の表面及び裏面に成膜されて、振動部１１０ｂから離間して周辺部１１０ａと接合する中間膜１２０、１３０と、中間膜１２０、１３０の表面に成膜されて中間膜１２０、１３０に積層される封止膜１４０、１５０と、を含む。【選択図】図１ |
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| AbstractList | PROBLEM TO BE SOLVED: To provide a piezoelectric device which is formed at a wafer level to enable cost reduction and achieves excellent vibration characteristics.SOLUTION: A piezoelectric device includes: a piezoelectric vibration piece 110 having a vibration part 110b which is thin compared to a periphery part 110a; intermediate films 120, 130 which are formed on a front surface and a rear surface of the piezoelectric vibration piece 110 and are joined to the periphery part 110a while separated from the vibration part 110b; and sealing films 140, 150 formed on surfaces of the intermediate films 120, 130 and laminated on the intermediate films 120, 130.SELECTED DRAWING: Figure 1
【課題】ウェハレベルで作成されることにより低コスト化を可能にするとともに、振動特性が優れた圧電デバイスを提供する。【解決手段】周辺部１１０ａに対して薄肉の振動部１１０ｂを有する圧電振動片１１０と、圧電振動片１１０の表面及び裏面に成膜されて、振動部１１０ｂから離間して周辺部１１０ａと接合する中間膜１２０、１３０と、中間膜１２０、１３０の表面に成膜されて中間膜１２０、１３０に積層される封止膜１４０、１５０と、を含む。【選択図】図１ |
| Author | YAN HANDONG |
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| DocumentTitleAlternate | 圧電デバイス |
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| Notes | Application Number: JP20170120972 |
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| RelatedCompanies | NIPPON DEMPA KOGYO CO LTD |
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| SubjectTerms | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS |
| Title | PIEZOELECTRIC DEVICE |
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