PRODUCING METHOD OF PLATING PART, PLATING PART, CATALYTIC ACTIVITY DISTURBING AGENT, AND ELECTROLESS PLATING COMPOUND MATERIAL

PROBLEM TO BE SOLVED: To provide producing method of a plating part enabled to form a plating film only in a predetermined pattern by suppressing the formation of the plating film in patterns other than the predetermined pattern by a simple production process.SOLUTION: A producing method of a platin...

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Bibliographic Details
Main Authors USUKI NAOKI, YUSA ATSUSHI, KITO AKIKO
Format Patent
LanguageEnglish
Japanese
Published 14.09.2017
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Summary:PROBLEM TO BE SOLVED: To provide producing method of a plating part enabled to form a plating film only in a predetermined pattern by suppressing the formation of the plating film in patterns other than the predetermined pattern by a simple production process.SOLUTION: A producing method of a plating part comprises the steps of: forming, on the surface of a substrate, a catalytic activity disturbing layer containing a polymer having at least one of an amide group and an amino group; heating or irradiating a portion of the surface of the substrate formed with the catalytic activity disturbing layer; applying an electroless plating catalyst to the surface of the substrate heated or irradiated; and forming an electroless plating film at a heated part or light-irradiated part of the surface by bringing an electroless plating liquid into contact with the surface of the substrate, to which the electroless plating catalyst is applied.SELECTED DRAWING: Figure 1 【課題】簡易な製造プロセスにより、所定パターン以外でのメッキ膜の生成を抑制し、所定パターンのみにメッキ膜を形成できるメッキ部品の製造方法を提供する。【解決手段】メッキ部品の製造方法であって、基材の表面に、アミド基及びアミノ基の少なくとも一方を有するポリマーを含む触媒活性妨害層を形成することと、前記触媒活性妨害層を形成した前記基材の表面の一部を加熱又は光照射することと、加熱又は光照射した前記基材の表面に無電解メッキ触媒を付与することと、前記無電解メッキ触媒を付与した前記基材の表面に無電解メッキ液を接触させ、前記表面の加熱部分又は光照射部分に無電解メッキ膜を形成することとを含む。【選択図】 図1
Bibliography:Application Number: JP20160048586