MULTILAYER PRINTED BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED BOARD

• Main Authors: OMORI ATSUFUMI, IWATA MUNEO, FUJITA ISATO, ISHIDA MASAAKI, TAKIZAWA TAKETO
• Format: Patent
• Language: English; Japanese
• Published: 27.07.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To solve such a problem that a ground layer is short-circuited with a signal line, etc., in a multilayer printed board.SOLUTION: A multilayer printed board includes: an insulating first base material having a first recessed portion on a side face; an insulating second base material provided to overlap the first base material and having a second recessed portion at least partially overlapping the first recessed portion; a conducting first ground layer provided between the first base material and the second base material and having an end portion that is exposed from between the first recessed portion and the second recessed portion; and a signal line provided to a principal face of the second base material, the principal face being on an opposite side to the first base material.SELECTED DRAWING: Figure 2 【課題】接地層が信号線等とショートする。【解決手段】多層プリント基板は、第１凹部を側面に有する絶縁性の第１基材と、前記第１基材に重なって設けられ、前記第１凹部と少なくとも一部が重なる第２凹部を側面に有する絶縁性の第２基材と、前記第１基材及び前記第２基材との間に設けられ、前記第１凹部及び前記第２凹部との間から端部が露出した導電性の第１接地層と、前記第１基材とは反対側の前記第２基材の主面に設けられた信号線と、を備える。【選択図】図２