PATTERN FORMING METHOD
PROBLEM TO BE SOLVED: To provide a pattern forming method capable of improving alignment accuracy between a template and a wafer.SOLUTION: According to one embodiment, there is provided a pattern forming method. The pattern forming method includes an auxiliary pattern forming step, and an imprint st...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
29.06.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a pattern forming method capable of improving alignment accuracy between a template and a wafer.SOLUTION: According to one embodiment, there is provided a pattern forming method. The pattern forming method includes an auxiliary pattern forming step, and an imprint step. In the auxiliary pattern forming step, an auxiliary pattern having a prescribed height in at least a part of an outer peripheral region having a height lower than that of a central region on a substrate is formed. In the imprint step, imprint processing is executed in a shot region including a part of the central region and a part of the outer peripheral region by using a template.SELECTED DRAWING: Figure 2
【課題】テンプレートとウェハとの間の位置合わせ精度を向上させることができるパターン形成方法を提供すること。【解決手段】実施形態によれば、パターン形成方法が提供される。前記パターン形成方法は、補助パターン形成ステップと、インプリントステップと、を含んでいる。前記補助パターン形成ステップでは、基板上で中央領域よりも高さが低い外周領域の少なくとも一部に対して、所定の高さを有した補助パターンが形成される。前記インプリントステップでは、前記中央領域の一部と前記外周領域の一部とを含むショット領域に、テンプレートを用いてインプリント処理が実行される。【選択図】図2 |
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Bibliography: | Application Number: JP20150255040 |