WIRING BOARD, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

• Main Authors: KANEDA WATARU, SHIMIZU NORIYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 15.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board capable of suppressing occurrence of resin breakage.SOLUTION: A wiring board 20 has: an insulation layer 30 made of an insulating resin essentially comprising a thermosetting resin; a recess 30Y formed on an upper surface 30A of the insulation layer 30; and a wiring layer 33 having an upper surface 33A exposed from the insulation layer 30 and formed in the recess 30Y. The wiring board 20 has: a via wiring 31 penetrating the insulation layer 30 in a thickness direction and having an upper end face 31A exposed from the insulation layer 30; and a wiring layer 40 formed on the upper surface 30A of the insulation layer 30 to be in contact with the upper end face 31A of the via wiring 31 and with an upper surface 33A of the wiring layer 33. The wiring board 20 has an insulation layer 41 made of an insulating resin essentially comprising a photosensitive resin, partially covering the wiring layer 40, covering a step formed by the wiring layer 33 and the wiring layer 40, and formed on the upper surface 30A of the insulation layer 30. The upper surface 30A of the insulation layer 30, the upper surface 33A of the wiring layer 33, and the upper end face 31A of the via wiring 31 are polished surfaces.SELECTED DRAWING: Figure 1 【課題】樹脂破壊の発生を抑制できる配線基板を提供する。【解決手段】配線基板２０は、熱硬化性樹脂を主成分とする絶縁性樹脂からなる絶縁層３０と、絶縁層３０の上面３０Ａに形成された凹部３０Ｙと、絶縁層３０から露出された上面３３Ａを有し、凹部３０Ｙに形成された配線層３３とを有する。配線基板２０は、絶縁層３０を厚さ方向に貫通し、絶縁層３０から露出された上端面３１Ａを有するビア配線３１と、ビア配線３１の上端面３１Ａ及び配線層３３の上面３３Ａに接するように、絶縁層３０の上面３０Ａに形成された配線層４０とを有する。配線基板２０は、感光性樹脂を主成分とする絶縁性樹脂からなり、配線層４０の一部を被覆し、配線層３３と配線層４０とによって形成される段差を被覆し、絶縁層３０の上面３０Ａに形成された絶縁層４１を有する。絶縁層３０の上面３０Ａと配線層３３の上面３３Ａとビア配線３１の上端面３１Ａとは研磨面である。【選択図】図１