DICING TAPE FOR INTEGRATED DICING AND DIE-BONDING TAPE

• Main Authors: IKETANI TAKUJI, SUZUMURA KOJI, SUZUKI MASAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a dicing tape for integrated dicing and die-bonding tape which produces less burr in the dicing process, and capable of picking up a thin wafer with a low push-up height amount without requiring to apply an excessive stress to a thin wafer in the die-bonding process.SOLUTION: A dicing tape for integrated dicing and die-bonding tape contains: an adhesive layer contains a (meth)acryl resin (A) containing, as components, 0.3-1.5 mmol/ga of chain-polymerizable functional group having glass transition temperature of -40°C or less, and a hydroxyl value of 20-150 mgKOH/g, where acid value is not detected substantially, and the weight-average molecular weight is 300,000 or more; a photoinitiator (B) capable of generating an active species that can be chain-polymerized when irradiated with at least one kind selected from UV-ray, electron beam, and visible light; and a crosslinking agent (C) having two or more functional groups capable of reacting with a hydroxyl group in one molecule, as components.SELECTED DRAWING: None 【課題】ダイシング工程においてバリが少なく、かつダイボンディング工程において、薄厚ウェハに対して過大な応力をかける必要なく、低突き上げハイト量でピックアップ可能なダイシング・ダイボンディング一体型テープ用ダイシングテープを提供する。【解決手段】粘着層が、ガラス転移温度が−４０℃以下、水酸基価が２０〜１５０ｍｇＫＯＨ／ｇ、連鎖重合可能な官能基を０．３〜１．５ｍｍｏｌ／ｇ含まれ、かつ酸価が実質検出されず、重量平均分子量が３０万以上である（メタ）アクリル樹脂（Ａ）と、紫外線、電子線、可視光線から選ばれる少なくとも１種を照射することで連鎖重合可能な活性種を発生しうる光開始剤（Ｂ）、及び水酸基と反応しうる官能基を１分子中に２つ以上有する架橋剤（Ｃ）を成分として含む、ダイシング・ダイボンディング一体型テープ用ダイシングテープ。【選択図】なし