ADHESIVE FOR THERMOPLASTIC RESIN

• Main Authors: MIZUTANI MANABU, SAWADA HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 09.02.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive for a thermoplastic resin capable attaining the improvement of appearance by suppressing the deformation of a thermoplastic resin molding while retaining required adhesive force owing to the suppression of a solvent to the thermoplastic resin molding.SOLU...