INTERPOSER AND CIRCUIT BOARD

• Main Authors: ADACHI TAKEMA, NODA KOTA
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a high-density interposer that is difficult to be lowered in connection reliability via a conductor in a heat cycle, and small in interval between adjacent conductors.SOLUTION: An interposer 10 includes a first surface F1, a second surface F2 opposite to the first surface F1, a third surface F3 perpendicular to the first surface F1, a fourth surface F4 opposite to the third surface F3, and is configured by an insulating plate formed of a plurality of insulating layers 301 laminated on the third surface F 3, and plural conductor layers 360 which are sandwiched between adjacent insulating layers 301, and have plural substantially straight conductors 36 extending from a first electrode 36D1 exposed from the first surface F1 to a second electrode 36D2 exposed from the second surface F2. The insulating layer 301 includes a second insulating layer formed of a conductor interlayer insulating layer 301A formed between adjacent conductor layers 360, and a conductor interlayer insulating layer 301B formed between adjacent conductors 36 in one conductor layer 360, and the conductor interlayer insulating layer 301A and the conductor interlayer insulating layer 301B are formed integrally with each other.SELECTED DRAWING: Figure 1 【課題】ヒートサイクルで導体を介する接続信頼性が低下しがたい、隣接する導体間の間隔が小さい、高密度なインターポーザを提供する。【解決手段】第１面Ｆ１と第１面Ｆ１と反対側の第２面Ｆ２と第１面Ｆ１に垂直な第３面Ｆ３と第３面Ｆ３と反対側の第４面Ｆ４とを有し、第３面Ｆ３上に積層されている複数の絶縁層３０１で形成されている絶縁板と、隣接する絶縁層３０１で挟まれ、第１面Ｆ１から露出する第１電極３６Ｄ１から第２面Ｆ２から露出する第２電極３６Ｄ２に延びる複数の略ストレートな導体３６を有する複数の導体層３６０とで形成される。絶縁層３０１は、隣接する導体層３６０間に形成されている導体層間絶縁層３０１Ａと一つの導体層３６０内の隣接する導体３６間に形成されている導体間絶縁層３０１Ｂで形成される第２絶縁層を含み、導体層間絶縁層３０１Ａと導体間絶縁層３０１Ｂは一体的に形成されているインターポーザ１０。【選択図】図１