WIRING BOARD FOR INSPECTION, AND MANUFACTURING METHOD OF WIRING BOARD FOR INSPECTION

• Main Authors: HIRANO SATOSHI, USAMI AKIHIRO, SUZUKI TETSUO
• Format: Patent
• Language: English; Japanese
• Published: 12.01.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; PRINTED CIRCUITS; TESTING

PROBLEM TO BE SOLVED: To provide a wiring board for inspection capable of suppressing slippage of an inspection probe when inspecting electric properties of an electronic component, and a manufacturing method of the wiring board for inspection.SOLUTION: The wiring board for inspection comprises a laminate structure which is formed by laminating one or more insulation layers and conductor layers, and is used for inspecting electric properties of an electronic component. On a principal surface of the laminate structure, the wiring board for inspection comprises: a pad group in which a plurality of pad parts to be a plurality of electrode pads to be abutted with the inspection probe in the electric property inspection are disposed in an array shape; and a dummy metal layer which is disposed around the pad group. Each of the plurality of pad parts forming the pad group includes a recess on a principal surface at a side to be abutted with the inspection probe.SELECTED DRAWING: Figure 1 【課題】電子部品の電気特性検査の際に、検査プローブの滑りを抑制できる検査用配線基板及び検査用配線基板の製造方法を提供すること。【解決手段】本発明に係る検査用配線基板は、絶縁層及び導体層がそれぞれ１層以上積層された積層構造体を有し、電子部品の電気特性検査の際に用いられる検査用配線基板であって、積層構造体の主面上に、電気特性検査の際に検査プローブと当接する複数の電極パッドとなる複数のパッド部がアレイ状に配置されたパッド群と、パッド群の周囲に配置されたダミー金属層とを備え、パッド群を構成する複数のパッド部は、検査プローブと当接する側の主面に窪みを有することを特徴とする。【選択図】図１