LED MODULE

• Main Author: KOBAYAKAWA MASAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 22.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a highly reliable LED module.SOLUTION: An LED module includes: a substrate 1; an LED chip 3 supported on the substrate; a metal wiring 2 installed on the substrate and including a mounting portion on which the LED chip is mounted; and an encapsulating resin 4 configured to cover the LED chip and the metal wiring. The LED module also includes a clad member 6 configured to cover the metal wiring to expose the mounting portion. The encapsulating resin covers the clad member. The metal wiring includes a wire bonding portion spaced apart from the mounting portion, and a wire configured to interconnect the LED chip and the wire bonding portion. The clad member covers the metal wiring to expose the wire bonding portion. The substrate includes a first edge and a second edge located on opposite sides to each other in a first direction. A first clad member is spaced apart from the fist edge.SELECTED DRAWING: Figure 2 【課題】より信頼性の高いＬＥＤモジュールを提供する。【解決手段】基板１と、基板に支持されるＬＥＤチップ３と、基板に設置され、ＬＥＤチップが搭載される搭載部を有する金属配線２と、ＬＥＤチップおよび金属配線を覆う封止樹脂４と、を備えたＬＥＤモジュールであって、搭載部を露出させるように金属配線を覆う被覆部材６を備えており、封止樹脂は被覆部材を覆っているとともに、金属配線は、搭載部と離間するワイヤボンディング部を有しており、ＬＥＤチップとワイヤボンディング部とを接続するワイヤを備えており、被覆部材は、ワイヤボンディング部を露出させるように金属配線を覆っており、基板は、互いに第１の方向において反対側に位置する、第１の端縁と第２の端縁とを有しており、第１の被覆部材は、第１の端縁から離間している。【選択図】図２