PHOTODETECTOR
PROBLEM TO BE SOLVED: To provide a photodetector capable of achieving electrical connection of a semiconductor substrate and a mounting substrate by a wire while restraining a mechanical strength of the semiconductor substrate from being reduced.SOLUTION: A semiconductor substrate 1N presents a poly...
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01.12.2016
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Abstract | PROBLEM TO BE SOLVED: To provide a photodetector capable of achieving electrical connection of a semiconductor substrate and a mounting substrate by a wire while restraining a mechanical strength of the semiconductor substrate from being reduced.SOLUTION: A semiconductor substrate 1N presents a polygonal shape having: a pair of first sides 1N1 facing each other and a pair of second sides 1N2 facing each other in a view in a direction where a principal surface 1Na faces a principal surface 1Nb; and a third side 1N3 which connects one first side 1N1 and one second side 1N2 and extends in one direction crossing the one first side 1N1 and the one second side 1N2. An electrode E3 disposed on the semiconductor substrate 1N and electrically connected with a plurality of pixels (avalanche photodiodes APD) and an electrode E5 disposed on a mounting substrate 20 are connected via a bonding wire W1 that extends over the third side 1N3 in the view in the direction where the principal surface 1Na faces the principal surface 1Nb.SELECTED DRAWING: Figure 4
【課題】半導体基板の機械的強度の低下を抑制しつつ、半導体基板と搭載基板との電気的な接続をワイヤにより実現することが可能な光検出装置を提供する。【解決手段】半導体基板1Nは、主面1Naと主面1Nbとが対向している方向から見て、互いに対向する一対の第一辺1N1と、互いに対向する一対の第二辺1N2と、一方の第一辺1N1と一方の第二辺1N2とを接続し、かつ、一方の第一辺1N1と一方の第二辺1N2とに交差する一方向に延びている第三辺1N3とを有する多角形状を呈している。半導体基板1Nに配置されていると共に複数の画素(アバランシェフォトダイオードAPD)と電気的に接続されている電極E3と、搭載基板20に配置されている電極E5とは、主面1Naと主面1Nbとが対向している方向から見て第三辺1N3を跨るように延びているボンディングワイヤW1を介して接続されている。【選択図】図4 |
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AbstractList | PROBLEM TO BE SOLVED: To provide a photodetector capable of achieving electrical connection of a semiconductor substrate and a mounting substrate by a wire while restraining a mechanical strength of the semiconductor substrate from being reduced.SOLUTION: A semiconductor substrate 1N presents a polygonal shape having: a pair of first sides 1N1 facing each other and a pair of second sides 1N2 facing each other in a view in a direction where a principal surface 1Na faces a principal surface 1Nb; and a third side 1N3 which connects one first side 1N1 and one second side 1N2 and extends in one direction crossing the one first side 1N1 and the one second side 1N2. An electrode E3 disposed on the semiconductor substrate 1N and electrically connected with a plurality of pixels (avalanche photodiodes APD) and an electrode E5 disposed on a mounting substrate 20 are connected via a bonding wire W1 that extends over the third side 1N3 in the view in the direction where the principal surface 1Na faces the principal surface 1Nb.SELECTED DRAWING: Figure 4
【課題】半導体基板の機械的強度の低下を抑制しつつ、半導体基板と搭載基板との電気的な接続をワイヤにより実現することが可能な光検出装置を提供する。【解決手段】半導体基板1Nは、主面1Naと主面1Nbとが対向している方向から見て、互いに対向する一対の第一辺1N1と、互いに対向する一対の第二辺1N2と、一方の第一辺1N1と一方の第二辺1N2とを接続し、かつ、一方の第一辺1N1と一方の第二辺1N2とに交差する一方向に延びている第三辺1N3とを有する多角形状を呈している。半導体基板1Nに配置されていると共に複数の画素(アバランシェフォトダイオードAPD)と電気的に接続されている電極E3と、搭載基板20に配置されている電極E5とは、主面1Naと主面1Nbとが対向している方向から見て第三辺1N3を跨るように延びているボンディングワイヤW1を介して接続されている。【選択図】図4 |
Author | IWASHINA SHINYA NAGANO TERUMASA KAMAKURA SHOGO |
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Snippet | PROBLEM TO BE SOLVED: To provide a photodetector capable of achieving electrical connection of a semiconductor substrate and a mounting substrate by a wire... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | PHOTODETECTOR |
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