SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, PRINT HEAD, IMAGE FORMATION DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To prevent a die-bonding material from coming into contact with a semiconductor element of a semiconductor chip.SOLUTION: A semiconductor chip 10 includes a semiconductor element 2 on a surface. On a side surface of the semiconductor chip 10, a retreat part (taper part 73 or ro...

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Bibliographic Details
Main Author MATSUO GENICHIRO
Format Patent
LanguageEnglish
Japanese
Published 10.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:PROBLEM TO BE SOLVED: To prevent a die-bonding material from coming into contact with a semiconductor element of a semiconductor chip.SOLUTION: A semiconductor chip 10 includes a semiconductor element 2 on a surface. On a side surface of the semiconductor chip 10, a retreat part (taper part 73 or rough shape 14) retreated to the inside of the semiconductor chip 10 is provided. By providing the retreat part, it is suppressed that a die-bonding material 9 creeps up along the side surface of the semiconductor chip 10 when the semiconductor chip 10 is mounted on a circuit board 8 or the like.SELECTED DRAWING: Figure 3 【課題】ダイボンディング材が半導体チップの半導体素子に接触することを防止する。【解決手段】半導体チップ１０は、表面に半導体素子２を有している。半導体チップ１０の側面には、半導体チップ１０の内側に退避した退避部（テーパ部７３または凹凸形状１４）を設けている。退避部を設けることにより、半導体チップ１０を回路基板８等に実装する際に、ダイボンディング材９が半導体チップ１０の側面に沿って這い上がることが抑制される。【選択図】図３
Bibliography:Application Number: JP20150071366