METHOD FOR MANUFACTURING CONDUCTIVE ADHESIVE

• Main Author: KUMAKURA HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 20.10.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To manufacture a conductive adhesive having a stably low connection resistance.SOLUTION: A container 22 arranged with conductive particles 17 exposing silver on their surface is carried into a heating tank 11 of a heating device 10, and its temperature is raised to a temperature range of 100°C or more and 180°C or less in a process gas environment containing 3.8% of hydrogen gas to reduce silver on the surface of conductive particles 17. The conductive particles 17 are not aggregated as the reduction reaction is carried out at a low temperature.SELECTED DRAWING: Figure 1 【課題】安定して接続抵抗が低い導電性接着剤を製造する。【解決手段】表面に銀が露出する導電粒子１７が配置された容器２２を加熱装置１０の加熱槽１１内に搬入し、水素ガスを３．８％で含有する処理ガス雰囲気中で、１００℃以上１８０℃以下の温度範囲に昇温させ、導電粒子１７表面の銀を還元する。還元反応が低温で行われるので、導電粒子は凝集しない。【選択図】 図１