SEMICONDUCTOR MEMORY DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor memory device that can improve operation reliability.SOLUTION: A semiconductor memory device of an embodiment includes: first and second memory cells; a first word line connected to gates of the first and second memory cells; a first bit line electric...
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22.08.2016
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Abstract | PROBLEM TO BE SOLVED: To provide a semiconductor memory device that can improve operation reliability.SOLUTION: A semiconductor memory device of an embodiment includes: first and second memory cells; a first word line connected to gates of the first and second memory cells; a first bit line electrically connected to one end of the first memory cell; and a second bit line electrically connected to one end of the second memory cell. A write operation includes a plurality of loops, which include: a first operation for applying a write voltage; a second operation for applying a first voltage lower than the write voltage; and a third operation for applying a verify voltage. When, in the third operation, a threshold voltage of the first memory cell is lower than a first threshold and a threshold voltage of the second memory cell is equal to or higher than the first threshold, a second voltage is applied to the first bit line and a third voltage lower than the second voltage is applied to the second bit line in the second operation.SELECTED DRAWING: Figure 5
【課題】動作信頼性を向上できる半導体記憶装置を提供する。【解決手段】実施形態の半導体記憶装置は、第1、第2メモリセルと、第1、第2メモリセルのゲートに接続された第1ワード線と、第1メモリセルの一端に電気的に接続された第1ビット線と、第2メモリセルの一端に電気的に接続された第2ビット線とを備える。書き込み動作は複数のループを含み、前記ループは書き込み電圧を印加する第1動作、書き込み電圧より低い第1電圧を印加する第2動作、及びベリファイ電圧を印加する第3動作を含む。前記第3動作において、第1メモリセルの閾値電圧が第1閾値より低く、第2メモリセルの閾値電圧が第1閾値以上であるとき、前記第2動作では、第1ビット線に第2電圧が印加され、第2ビット線に前記第2電圧より低い第3電圧が印加される。【選択図】図5 |
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AbstractList | PROBLEM TO BE SOLVED: To provide a semiconductor memory device that can improve operation reliability.SOLUTION: A semiconductor memory device of an embodiment includes: first and second memory cells; a first word line connected to gates of the first and second memory cells; a first bit line electrically connected to one end of the first memory cell; and a second bit line electrically connected to one end of the second memory cell. A write operation includes a plurality of loops, which include: a first operation for applying a write voltage; a second operation for applying a first voltage lower than the write voltage; and a third operation for applying a verify voltage. When, in the third operation, a threshold voltage of the first memory cell is lower than a first threshold and a threshold voltage of the second memory cell is equal to or higher than the first threshold, a second voltage is applied to the first bit line and a third voltage lower than the second voltage is applied to the second bit line in the second operation.SELECTED DRAWING: Figure 5
【課題】動作信頼性を向上できる半導体記憶装置を提供する。【解決手段】実施形態の半導体記憶装置は、第1、第2メモリセルと、第1、第2メモリセルのゲートに接続された第1ワード線と、第1メモリセルの一端に電気的に接続された第1ビット線と、第2メモリセルの一端に電気的に接続された第2ビット線とを備える。書き込み動作は複数のループを含み、前記ループは書き込み電圧を印加する第1動作、書き込み電圧より低い第1電圧を印加する第2動作、及びベリファイ電圧を印加する第3動作を含む。前記第3動作において、第1メモリセルの閾値電圧が第1閾値より低く、第2メモリセルの閾値電圧が第1閾値以上であるとき、前記第2動作では、第1ビット線に第2電圧が印加され、第2ビット線に前記第2電圧より低い第3電圧が印加される。【選択図】図5 |
Author | HOSONO KOJI |
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Snippet | PROBLEM TO BE SOLVED: To provide a semiconductor memory device that can improve operation reliability.SOLUTION: A semiconductor memory device of an embodiment... |
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Title | SEMICONDUCTOR MEMORY DEVICE |
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