CASTING PACKAGE SOLDERING METHOD WITH PLATING SILVER SOLDER

• Main Authors: YAMADA TOMIO, HARADA TETSUO, KONISHI NOBUO
• Format: Patent
• Language: English; Japanese
• Published: 22.08.2016
• Subjects: APPARATUS THEREFOR; CASTING; CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a casting package soldering method with silver solder that enables heat radiation casting package of a fin tube and a precision machined component into a special steel.SOLUTION: A casting package soldering method with plating silver solder includes the steps of: adding an unsaturated fatty acid with a molecular weight of 200-300 or a chlorinated organic solvent in plating liquid in plating each plating silver layer, when Hi-Cr casting iron is silver-soldered to the surface of a steel material serving as the casting package aggregate via a plurality of plating film layers of two or more layers with interlayer dissimilar metals; making pulse current flow into the plating liquid to produce the plating layer by generating pin holes of 15%-20% in the plating layer; applying an inorganic compound flux with a concentration of 30%-50% and a heat-resistant temperature of 450°C-1000°C after a final plating layer is produced to impregnate the inorganic compound flux into the pin holes; and thereafter casting molten Hi-Cr casting iron to turn a plurality of plating film layers silver-soldered by plating on Kagendol effect caused by the impregnated flux in the pin holes, by melting heat.SELECTED DRAWING: Figure 1 【課題】フインチューブの熱放熱鋳包みや精密機械加工品を特殊鋼の中に鋳込む等を可能にした銀鑞による鋳包み鑞付法を提供する。【解決手段】鋳包み骨材となる鋼材の表面に、層間異種金属で2層以上の複数層の鍍金膜介してＨｉ−Cr鋳鉄を銀鑞付するにおいて、各鍍金層毎の鍍金の際、当該鍍金液中に分子量200〜300の不飽和脂肪酸か塩素系の有機溶剤を添加し当該鍍金液体中にパルス電流等を流して当該鍍金層に15〜20%のピンホールを生成して当該鍍金層を生成し、最終鍍金層を生成後に濃度30%〜50%で且つ耐熱温度が450℃〜1000℃の無機化合物fluxを塗布して前記ピンホール内に前記無機化合物fluxを含浸させ、この後溶融Ｈｉ−Cr鋳鉄を鋳込み、その溶解熱で前記ピンホール内の含浸fluxによるカーゲンドル効果にて複数層の鍍金膜を鍍金銀鑞化させることを特徴とするメッキ銀鑞による鋳込み銀鑞付法。【選択図】図１