SUBSTRATE PROCESSING METHOD AND DEVICE

• Main Authors: MOCHIDA TEPPEI, NAKAI HITOSHI, FURUTA RINTARO
• Format: Patent
• Language: English; Japanese
• Published: 23.06.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent inadequate processing of a substrate from being continued, by detecting and informing leakage of process liquid after its supply is stopped.SOLUTION: A control section 53 supplies a hydrofluoric acid from a supply pipe 23 by opening a discharge valve 33, and supplies...