SUBSTRATE PROCESSING METHOD AND DEVICE

• Main Authors: MOCHIDA TEPPEI, NAKAI HITOSHI, FURUTA RINTARO
• Format: Patent
• Language: English; Japanese
• Published: 23.06.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent inadequate processing of a substrate from being continued, by detecting and informing leakage of process liquid after its supply is stopped.SOLUTION: A control section 53 supplies a hydrofluoric acid from a supply pipe 23 by opening a discharge valve 33, and supplies hydrofluoric acid for a substrate W in a processing section 1. After a predetermined amount of hydrofluoric acid is supplied, the discharge valve 33 is closed and hydrofluoric acid supply is stopped. When leakage of hydrofluoric acid is detected on the basis of a signal, depending on the flow rate from a flowmeter 35, the control section 53 informs leakage of hydrofluoric acid. Consequently, inadequate processing of a substrate can be prevented from being continued.SELECTED DRAWING: Figure 1 【課題】処理液の供給停止後における処理液の漏れを検知して報知することにより、基板への不適切な処理が継続的に行われることを防止できる。【解決手段】制御部５３は、吐出バルブ３３を開放させてフッ化水素酸を供給管２３から供給し、処理部１の基板Ｗに対してフッ化水素酸を供給する。所定量のフッ化水素酸の供給後、吐出バルブ３３を閉止させてフッ化水素酸の供給を停止させる。そして、制御部５３は、流量計３５から流量に応じた信号に基づいて、フッ化水素酸の漏れが検出された場合にはフッ化水素酸の漏れを報知する。したがって、基板Ｗへの不適切な処理が継続的に行われることを防止できる。【選択図】図１