REFRIGERATION DEVICE

• Main Authors: IKEDA MOTONOBU, SAITO TADASHI, FUJIWARA MASAHIDE, ISHIZEKI SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 20.06.2016
• Subjects: AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING; BLASTING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; RANGES; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; VENTILATING; WEAPONS

PROBLEM TO BE SOLVED: To provide a refrigeration device which suppresses deterioration of reliability and increase in cost.SOLUTION: An air conditioner includes: an element to be cooled 60 for generating heat when electricity is conducted; a printed circuit board 71 on which the element to be cooled 60 is mounted; a liquid refrigerant pipe; and a refrigerant jacket 29 for cooling the element to be cooled 60. The element to be cooled 60 has: a body part 61; and a plurality of leads 62 extending from the body part 61. The refrigerant jacket 29 is located between the body part 61 and the liquid refrigerant pipe, and comes into contact with the body part 61 and the liquid refrigerant pipe 35. The element to be cooled 60 is mounted on the printed circuit board 71 by the lead 62 being bonded to the printed circuit board 71, in a state where the body part 61 is fixed to the refrigerant jacket 29. The element to be cooled 60 is located between the refrigerant jacket 29 and the printed circuit board 71, in a state of being mounted on the printed circuit board 71. In the lead 62, a moisture-proof material 90 is coated at one part for suppressing attachment of dew condensation water.SELECTED DRAWING: Figure 8 【課題】信頼性低下及びコスト増大を抑制する冷凍装置を提供する。【解決手段】空気調和機は、通電されると発熱する被冷却素子６０と、被冷却素子６０が実装されるプリント基板７１と、液冷媒配管と、被冷却素子６０を冷却する冷媒ジャケット２９とを備える。被冷却素子６０は、本体部６１と、本体部６１から延びる複数のリード６２とを有する。冷媒ジャケット２９は、本体部６１及び液冷媒配管の間に位置し、本体部６１及び液冷媒配管３５に当接する。被冷却素子６０は、本体部６１を冷媒ジャケット２９に固定された状態で、リード６２をプリント基板７１に接合されてプリント基板７１に実装される。被冷却素子６０は、プリント基板７１に実装された状態において、冷媒ジャケット２９及びプリント基板７１の間に位置する。リード６２は、その一部に、結露水の付着を抑制する防湿材９０がコーティングされる。【選択図】図８