MULTILAYER CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER CIRCUIT BOARD

• Main Authors: BABA TAKAYUKI, TAKEYA MITSUO, MARUYAMA TOYOTARO, ITO KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 09.05.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a multilayer circuit board excellent in reflow heat resistance and a method for manufacturing the same.SOLUTION: A multilayer circuit board includes: a multilayer substrate 500 which has such a multilayer structure that an insulating layer 30 and a circuit layer 20 are alternately laminated, whose the outermost layer constituting at least one surface of the multilayer structure is the circuit layer 20; a plating film 40 provided on the surface of the circuit layer 20; and an insulating resin layer 200 which is provided on a surface in an opposite side to the circuit layer 20 of the plating film 40. The insulating resin layer 200 is formed of a resin composition containing a thermosetting resin, and a guanidine derivative having a guanidine structural unit in a molecular structure. The guanidine structural unit is a guanidine group represented by the following formula (1).SELECTED DRAWING: Figure 1 【課題】リフロー耐熱性に優れた多層回路基板、およびその製造方法を提供する。【解決手段】絶縁層３０および回路層２０が交互に積層した多層構造を有し、前記多層構造の少なくとも一方の面を構成する最外層が回路層２０である多層基材５００と、前記回路層２０の表面に設けられためっき膜４０と、前記めっき膜４０の前記回路層２０とは反対側の面に設けられた絶縁樹脂層２００とを備え、前記絶縁樹脂層２００が、熱硬化性樹脂と、分子構造中にグアニジン構造単位を有するグアニジン誘導体と、を含む樹脂組成物により形成され、前記グアニジン構造単位が、下記式（１）に示されるグアニジン基である。【化１】【選択図】図１