PARISON HOLDING AND CUTTING DEVICE AND PARISON HOLDING AND CUTTING METHOD

• Main Authors: YAMADA TAKUO, NARUTAKI KOICHI, USAMI AKIHIRO, HIROTA MUNEHISA, KANEKO EIICHIRO, YONEDA ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 28.04.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; MAKING GRANULES OR PREFORMS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To divide a parison surely, even when an operation for upward moving a die head, is eliminated, and suppress a cut area of the parison from being crushed, when a parison being discharged continuously from the die head is cut for a supply unit to a mold.SOLUTION: A parison cutting device 1 comprises: a binding chuck 2 for binding a parison P discharged from a die head 10, by gripping surrounding of the parison P; and a cutter 3 for cutting the parison P right under the binding chuck 2.SELECTED DRAWING: Figure 1 【課題】連続してダイヘッドから吐出されるパリソンを金型への供給単位で切断するに際して、ダイヘッドを上方に移動させる動作を省いてもパリソンを確実に分断することができ、また、パリソンの切り口が潰れてしまうのを抑止する。【解決手段】パリソン切断装置１は、パリソンＰの周囲を把持してダイヘッド１０から吐出されるパリソンＰを拘束する拘束チャック２と、拘束チャック２の直下でパリソンＰを切断するカッター３とを備える。【選択図】図１