JOINED MATERIAL, SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR HEAT SINK-EQUIPPED POWER MODULE, MANUFACTURING METHOD OF JOINED MATERIAL, MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE, AND MANUFACTURING METHOD OF SUBSTRATE FOR HEAT SINK-EQUIPPED POWER MODULE

• Main Authors: NAGATOMO YOSHIYUKI, TERASAKI NOBUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 31.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a joined material which enables the suppression of creation of crack in a join of an aluminum member and a metal member under the load of a heat cycle, and enables the suppression of the worsening of join reliability owing to a thermal stress loaded to an interface of the joining of a ceramic member and the aluminum member.SOLUTION: A joined material comprises: ceramic member 11; an aluminum member 21; and a metal member 22. The aluminum member 21 has: a first aluminum member 21A joined to the ceramic member 11; and a second aluminum member 21B joined to the metal member. The first aluminum member 21A includes aluminum of a purity of 99.99 mass% or more in a state before joining. The second aluminum member 21B includes aluminum in which the concentration of Si is within a range of 0.03-1.0 mass% in a state before joining. The metal member 22 is joined to a Ti-layer 25 by solid phase diffusion, and the Ti-layer 25 is joined to the second aluminum member 21B in the same way.SELECTED DRAWING: Figure 1 【課題】ヒートサイクルが負荷された際にアルミニウム部材と金属部材との接合部におけるクラックの発生を抑制できるとともに、セラミックス部材とアルミニウム部材との接合界面に負荷される熱応力によって接合信頼性が低下することを抑制可能な接合体を提供する。【解決手段】アルミニウム部材２１は、セラミックス部材１１に接合された第１アルミニウム部材２１Ａと、金属部材に接合された第２アルミニウム部材２１Ｂとを有し、第１アルミニウム部材２１Ａは、接合前の状態で純度９９．９９ｍａｓｓ％以上のアルミニウムで構成され、第２アルミニウム部材２１Ｂは、接合前の状態でＳｉ濃度が０．０３ｍａｓｓ％以上１．０ｍａｓｓ％以下の範囲内とされたアルミニウムで構成されており、金属部材２２とＴｉ層２５及びＴｉ層２５と第２アルミニウム部材２１Ｂが、それぞれ固相拡散接合されている。【選択図】図１