BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

• Main Authors: SUGIHARA SHINTARO, FURUYA HAJIME, MANABE EIJI, OMORI YOSUKE, MIMURA TAKEYUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To bond substrates appropriately, by adjusting the position of the substrates to be bonded in the horizontal direction.SOLUTION: A bonding device 41 has an upper chuck 140 for suction holding an upper wafer Wto the lower surface by vacuuming, and a lower chuck 141 provided below the upper chuck 140, and suction holding a lower wafer Wto the upper surface by vacuuming. The lower chuck 141 has a body 190 for vacuuming the lower wafer W, and a plurality of pins 191 provided on the body 190 in contact with the back of the lower wafer W. Tip position of a pin 191a provided in the center of the body 190 is higher than the tip position of a pin 191b provided on the outer periphery of the body 190.SELECTED DRAWING: Figure 6 【課題】接合される基板同士の水平方向位置を適切に調節し、当該基板同士の接合処理を適切に行う。【解決手段】接合装置４１は、下面に上ウェハＷＵを真空引きして吸着保持する上チャック１４０と、上チャック１４０の下方に設けられ、上面に下ウェハＷＬを真空引きして吸着保持する下チャック１４１と、を有する。下チャック１４１は、下ウェハＷＬを真空引きする本体部１９０と、本体部１９０上に設けられ、下ウェハＷＬの裏面に接触する複数のピン１９１と、を有する。本体部１９０の中心部に設けられたピン１９１ａの先端位置は、本体部１９０の外周部に設けられたピン１９１ｂの先端位置よりも高い。【選択図】図６