BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM
PROBLEM TO BE SOLVED: To bond substrates appropriately, by adjusting the position of the substrates to be bonded in the horizontal direction.SOLUTION: A bonding device 41 has an upper chuck 140 for suction holding an upper wafer Wto the lower surface by vacuuming, and a lower chuck 141 provided belo...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
22.03.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To bond substrates appropriately, by adjusting the position of the substrates to be bonded in the horizontal direction.SOLUTION: A bonding device 41 has an upper chuck 140 for suction holding an upper wafer Wto the lower surface by vacuuming, and a lower chuck 141 provided below the upper chuck 140, and suction holding a lower wafer Wto the upper surface by vacuuming. The lower chuck 141 has a body 190 for vacuuming the lower wafer W, and a plurality of pins 191 provided on the body 190 in contact with the back of the lower wafer W. Tip position of a pin 191a provided in the center of the body 190 is higher than the tip position of a pin 191b provided on the outer periphery of the body 190.SELECTED DRAWING: Figure 6
【課題】接合される基板同士の水平方向位置を適切に調節し、当該基板同士の接合処理を適切に行う。【解決手段】接合装置41は、下面に上ウェハWUを真空引きして吸着保持する上チャック140と、上チャック140の下方に設けられ、上面に下ウェハWLを真空引きして吸着保持する下チャック141と、を有する。下チャック141は、下ウェハWLを真空引きする本体部190と、本体部190上に設けられ、下ウェハWLの裏面に接触する複数のピン191と、を有する。本体部190の中心部に設けられたピン191aの先端位置は、本体部190の外周部に設けられたピン191bの先端位置よりも高い。【選択図】図6 |
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Bibliography: | Application Number: JP20140161628 |