HEAT TRANSFER DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC DEVICE

• Main Authors: SUKEGAWA EIJI, KIMURA TAKAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 17.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; WEAPONS

PROBLEM TO BE SOLVED: To improve the airtightness of a passage in a heat transfer device, a manufacturing method of the heat transfer device, and an electronic device.SOLUTION: A heat transfer device 21 comprises: two resin sheets 22 including grooves 22b overlapped with each other and formed on inner surfaces 22a of the two resin sheets 22, at least one of the two resin sheets 22 being transparent; metal layers 27 formed on the inner surfaces 22a of the two resin sheets 22 and welded to each other; and a working fluid enclosed in the grooves 22b.SELECTED DRAWING: Figure 7 【課題】熱輸送デバイスとその製造方法、及び電子機器において、流路の気密性を向上させること。【解決手段】互いに重なる溝２２ｂがそれぞれの内表面２２ａに形成され、少なくとも一方が透明な二枚の樹脂シート２２と、二枚の樹脂シート２２のそれぞれの内表面２２ａに形成され、かつ、互いに溶着された金属層２７と、溝２２ｂに封入された作動液とを有する熱輸送デバイス２１による。【選択図】図７