POLISHING COMPOSITION

PROBLEM TO BE SOLVED: To provide a polishing composition including colloidal silica, which is superior in polishing speed and settling stability.SOLUTION: A polishing composition of the present invention comprises colloidal silica. Supposing that the average aspect ratio of the colloidal silica is A...

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Bibliographic Details
Main Authors TAHARA MUNEAKI, ASHITAKA KEIJI, MORINAGA HITOSHI
Format Patent
LanguageEnglish
Japanese
Published 28.01.2016
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOUNDS THEREOF
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INORGANIC CHEMISTRY
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-METALLIC ELEMENTS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a polishing composition including colloidal silica, which is superior in polishing speed and settling stability.SOLUTION: A polishing composition of the present invention comprises colloidal silica. Supposing that the average aspect ratio of the colloidal silica is A (dimensionless), the particle diameter of the colloidal silica is D (in nanometers), a standard deviation of particle diameters of the colloidal silica is E (in nanometers), and the percentage by volume that particles of 1-300 nm in particle diameter account for in the colloidal silica is F (in percentage), a value determined the following expression is 350,000 or larger: A×D×E×F. In addition, particles having particle diameters of 1-300 nm account for 90% or more by volume in the colloidal silica, and particles having particle diameters of 50 nm or larger and aspect ratios of 1.2 or larger account for 50% or more by volume in the colloidal silica. 【課題】優れた研磨速度と沈降安定性を両立したコロイダルシリカを含んだ研磨用組成物を提供する。【解決手段】本発明の研磨用組成物はコロイダルシリカを含有する。コロイダルシリカの平均アスペクト比をＡ（無次元）、コロイダルシリカの平均粒子径をＤ（単位ｎｍ）、コロイダルシリカの粒子径の標準偏差をＥ（単位ｎｍ）、コロイダルシリカ中に占める粒子径が１〜３００ｎｍである粒子の体積割合をＦ（単位％）としたとき、式：Ａ?Ｄ?Ｅ?Ｆで求められる値が３５０，０００以上であり、なおかつ、コロイダルシリカ中に占める粒子径が１〜３００ｎｍである粒子の体積割合が９０％以上であり、コロイダルシリカ中に占める粒子径が５０ｎｍ以上でかつアスペクト比が１．２以上である粒子の体積割合は５０％以上である。【選択図】なし
Bibliography:Application Number: JP20150153446