HEAT SINK

PROBLEM TO BE SOLVED: To measure temperature of a contact surface between a heat sink and a semiconductor.SOLUTION: A heat sink piece constituting a through hole for a temperature sensor is connected. 【課題】ヒートシンクと半導体接触面温度の測定。【解決手段】 温度センサー用スルーホールを構成したヒートシンク片を接続する。【選択図】図5...

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Bibliographic Details
Main Author TERADA ATSUSHI
Format Patent
LanguageEnglish
Japanese
Published 21.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To measure temperature of a contact surface between a heat sink and a semiconductor.SOLUTION: A heat sink piece constituting a through hole for a temperature sensor is connected. 【課題】ヒートシンクと半導体接触面温度の測定。【解決手段】 温度センサー用スルーホールを構成したヒートシンク片を接続する。【選択図】図5
Bibliography:Application Number: JP20140131957