RESIN FILM PROCESSING DEVICE

• Main Authors: SUDO FUMIHIKO, MIZOZOE TAKAAKI, EZAKI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 07.01.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CONVEYING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; HANDLING THIN OR FILAMENTARY MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PACKING; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; STORING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a resin film processing device which stably forms holes in a resin film.SOLUTION: A resin film processing device 1 includes: conveyance means 2 which conveys a resin film 20 having a long shape along a longitudinal direction of the resin film 20; hole formation means 3 having a laser light radiation part 31 which radiates laser light L to a middle portion of the resin film 20 conveyed by the conveyance means 2 and thereby forms a hole 201 in each radiated portion; and gas jetting means 5 having a jetting port 511, which jets a gas G along a surface direction of the resin film 20, between the laser light radiation part 31 and the resin film 20. 【課題】樹脂フィルムに孔を安定して形成することができる樹脂フィルム加工装置を提供すること。【解決手段】樹脂フィルム加工装置１は、長尺状をなす樹脂フィルム２０をその長手方向に沿って搬送する搬送手段２と、搬送手段２によって搬送されている途中の樹脂フィルム２０に対してレーザ光Ｌを照射することにより、その照射された部分に孔２０１を形成するレーザ光照射部３１を有する孔形成手段３と、レーザ光照射部３１と樹脂フィルム２０との間に樹脂フィルム２０の面方向に沿ってガスＧを噴出する噴出口５１１を有するガス噴出手段５とを備える。【選択図】図３