ELECTRONIC DEVICE

• Main Authors: NAKAMURA TOSHIHIRO, YABUTA EIJI
• Format: Patent
• Language: English; Japanese
• Published: 19.11.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic device in which the linear expansion coefficient of a wiring board can be reduced, curvature deformation of the wiring board can be suppressed and eventually warp of the whole device can be suppressed by reducing the linear expansion coefficient of an a...