FLOW SENSOR AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a flow sensor that can be miniaturized and for which a manufacturing process can be simplified.SOLUTION: Each of flow sensors 1 includes: a substrate 2; a flow passage constitution film 7 that is formed on a surface 2a of the substrate 2 and constitutes a fluid flow...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
05.10.2015
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a flow sensor that can be miniaturized and for which a manufacturing process can be simplified.SOLUTION: Each of flow sensors 1 includes: a substrate 2; a flow passage constitution film 7 that is formed on a surface 2a of the substrate 2 and constitutes a fluid flow passage 71 for passing a fluid; and a sensing unit 3 that is arranged on the surface 2a of the substrate 2 and detects the flow rate of the fluid that passes through the fluid flow passage 71. The flow passage constitution film 7 is a patterned film and has a recess 7a. The fluid flow passage 71 includes in a region surrounded by the recess 7a and substrate 2: a first opening part 71a that is an opening part for introducing the fluid; and a second opening part 71b that is an opening part for discharging the fluid to the outside. The flow sensors 1 can be manufactured by a bottom-up type manufacturing technology by which the flow sensors 1 are formed on a single wafer 200 by forming the fluid flow passage 71 on the wafer in a semiconductor process, thereby enabling the plurality of flow sensors 1 to be processed simultaneously.
【課題】小型化可能であり、製造工程を簡略化できる流量センサを提供する。【解決手段】流量センサ1は、基板2と、基板2の表面2a上に形成され、流体を通すための流体流路71を構成する流路構成膜7と、基板2の表面2aに配置され、流体流路71を通る流体の流量を検出するセンシング部3とを有する。流路構成膜7は、パターニングされた膜であり、凹部7aを有する。流体流路71は、凹部7aと基板2とによって囲まれた領域によって、流体を導入するための開口部である第1開口部71aおよび流体を外部に排出するための開口部である第2開口部71bを有する構成とされる。流量センサ1の製造においては、半導体プロセスにおいてウェハ200に流体流路71を形成して流量センサ1を単一ウェハ上に作り上げるボトムアップ式製法技術によって製造でき、複数の流量センサ1を同時に加工可能となる。【選択図】図1 |
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Bibliography: | Application Number: JP20140052161 |