ADHESIVE AGENT COMPOSITION FOR HOT MELT

• Main Authors: TANAKA SHINYA, YOSHIMOTO KOYA, AKAI IKUO, YAMAGUCHI MASAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 05.10.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive for hot melts which has a long open time and excellent adhesive strength.SOLUTION: An adhesive agent composition for hot melts comprises 1-50 mass% of a 1-butene-α-olefin random copolymer (Y) having (i) a ratio (Mw/Mn) of the wt. average molecular wt. Mw...