MULTILAYER SUBSTRATE WITH BUILT-IN INDUCTANCE ELEMENT, AND MANUFACTURING METHOD THEREOF

• Main Authors: KATAOKA RYOHEI, HIRABAYASHI MASAYA, KONDO KOJI
• Format: Patent
• Language: English; Japanese
• Published: 06.08.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To prevent an internal structure of a multilayer substrate with a built-in inductance element from being destroyed during heating treatment to the multilayer substrate after manufacturing the multilayer substrate.SOLUTION: In a state where a thermoplastic resin film 41 is dispo...