MULTILAYER SUBSTRATE WITH BUILT-IN INDUCTANCE ELEMENT, AND MANUFACTURING METHOD THEREOF

• Main Authors: KATAOKA RYOHEI, HIRABAYASHI MASAYA, KONDO KOJI
• Format: Patent
• Language: English; Japanese
• Published: 06.08.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To prevent an internal structure of a multilayer substrate with a built-in inductance element from being destroyed during heating treatment to the multilayer substrate after manufacturing the multilayer substrate.SOLUTION: In a state where a thermoplastic resin film 41 is disposed on a bottom face 13a of an annular cavity 13 in a holding substrate 10, a dust core 6 is inserted into the cavity 13 and then, the holding substrate 10 and a plurality of resin films 20 are laminated, thereby forming a laminate. In the state where the thermoplastic resin film 41 is present between a bottom face of the dust core 6 and the bottom face 13a of the cavity 13, the laminate is heated and pressurized. Thus, the thermoplastic resin film 41 is softened, and fine irregularity being present on the bottom face of the dust core 6 and the bottom face 13a of the cavity 13 can be filled. Therefore, an internal structure of the multilayer substrate can be prevented from being destroyed due to expansion of a gas being present in a gap between the bottom face of the dust core 6 and the bottom face of the cavity 13 during heating treatment to the multilayer substrate after manufacturing the multilayer substrate. 【課題】インダクタンス素子内蔵多層基板の製造後における多層基板に対する加熱処理時での多層基板の内部構造の破壊を防止する。【解決手段】保持基板１０の環状のキャビティ１３の底面１３ａに熱可塑性樹脂フィルム４１を配置した状態で、キャビティ１３にダストコア６を挿入した後に、保持基板１０と複数の樹脂フィルム２０とを積層して積層体を形成する。そして、ダストコア６の下面とキャビティ１３の底面１３ａとの間に熱可塑性樹脂フィルム４１が存在する状態で、積層体を加熱加圧する。これにより、熱可塑性樹脂フィルム４１が軟化して、ダストコア６の下面とキャビティ１３の底面１３ａに存在する微細な凹凸を埋められる。このため、多層基板製造後の多層基板に対する加熱処理時に、ダストコア６の下面とキャビティ１３の底面との隙間に存在する気体が膨張することによって発生する多層基板の内部構造の破壊を防止できる。【選択図】図１３