SUBSTRATE PROCESSING APPARATUS, AND LIQUID SUPPLY DEVICE

• Main Author: INOUE SHIGEHISA
• Format: Patent
• Language: English; Japanese
• Published: 30.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve in-plane uniformity of substrate processing.SOLUTION: A substrate processing apparatus according to the embodiment comprises a holding mechanism, a plurality of nozzles, and an adjustment part. The holding mechanism holds a substrate rotatably. The plurality of nozzles are arranged in a row in a radial direction of the substrate held by the holding mechanism, and supply chemical liquid to the substrate. The adjustment part supplies chemical liquid of first temperature and chemical liquid of second temperature higher than the first temperature to each nozzle at predetermined ratio. Further, the adjustment part supplies the chemical liquid of the second temperature to nozzles arranged at positions closer to an outer periphery part of the substrate at a larger ratio than nozzles arranged at positions closer to a central part of the substrate. Then, each nozzle supplies mixed chemical liquid of the chemical liquid of the first temperature and the chemical liquid of the second temperature, which are supplied, to the substrate. 【課題】基板処理の面内均一性を高めること。【解決手段】実施形態に係る基板処理装置は、保持機構と、複数のノズルと、調整部とを備える。保持機構は、基板を回転可能に保持する。複数のノズルは、保持機構に保持された基板の径方向に並べて配置され、基板に対して薬液を供給する。調整部は、第１温度の薬液と第１温度よりも高温の第２温度の薬液とを予め決められた割合で各ノズルへ供給する。また、調整部は、基板の外周部側に配置されるノズルに対して、基板の中心部側に配置されるノズルよりも第２温度の薬液を多い割合で供給する。そして、各ノズルは、供給された第１温度の薬液と第２温度の薬液とが混合された薬液を基板に対して供給する。【選択図】図３