SUBSTRATE TREATMENT SYSTEM

• Main Authors: ICHINOMIYA KENJI, ISHIDA YOSHITAKA
• Format: Patent
• Language: English; Japanese
• Published: 16.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PHYSICS; REGULATING; SEMICONDUCTOR DEVICES; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a substrate treatment system that can stably supply treatment liquid of a predetermined concentration to a treatment unit.SOLUTION: A substrate treatment system comprises: a first fluid supply flow passage (77) for supplying fluid; a second fluid supply flow passage (79) in which a solution module (72) for solving gas into the fluid is provided in a middle part; a first pressure regulator (81) provided in the first fluid supply flow passage; a second pressure regulator (82) provided in the second fluid supply flow passage; a treatment liquid supply flow passage (80) that merges the first fluid supply flow passage with the second fluid supply flow passage and supplies the treatment liquid to a treatment unit (16); and flow rate regulators (84) which are provided downstream from the first pressure regulator in the first fluid supply flow passage and between downstream from the second pressure regulator in the second fluid supply flow passage and upstream from the solution module in the second fluid supply flow passage, and which, when an inner pressure of the first fluid supply flow passage increases or decreases relative to the inner pressure of the second fluid supply flow passage, decreases or increases the flow rate of the fluid flowing through the second fluid supply flow passage. 【課題】基板処理システムにおいて所定濃度の処理液を処理ユニットに安定して供給すること。【解決手段】本発明では、流体を供給する第１の流体供給流路(77)と、流体にガスを溶解させるための溶解モジュール(72)を中途部に設けた第２の流体供給流路(79)と、第１の流体供給流路に設けられた第１の圧力調整器(81)と、第２の流体供給流路に設けられた第２の圧力調整器(82)と、第１の流体供給流路と第２の流体供給流路とを合流させて処理ユニット(16)に処理液を供給する処理液供給流路(80)と、第１の流体供給流路の第１の圧力調整器よりも下流側と第２の流体供給流路の第２の圧力調整器よりも下流側であって溶解モジュールよりも上流側との間に設けられ、第１の流体供給流路の内圧が第２の流体供給流路の内圧に対して増大又は減少したときに第２の流体供給流路を流れる流体の流量を減少又は増大させる流量調整器(84)とを有することにした。【選択図】図３