SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: YOSHIMATSU NAOKI, MURATA DAISUKE, IMOTO YUJI, ARAGAI MASAYOSHI, ISHIHARA MIKIO, KANO TAKETOSHI, KIMOTO NOBUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 13.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which satisfy both of downsizing and improvement in reliability of the semiconductor device at low cost.SOLUTION: A semiconductor device according to the present embodiment comprises: a ceramic board 1; a plurality of circuit patterns 1a arranged on a surface of the ceramic board 1; a semiconductor element 2 arranged on a surface of at least one circuit pattern 1a; and an encapsulation resin 4 for encapsulating the ceramic board 1, the plurality of circuit patterns 1a and the semiconductor element 2. The semiconductor device further comprises undercut parts 1aa formed on opposed lateral faces of the adjacent circuit patterns 1a. At the undercut parts 1aa, an end 11 of each surface of the circuit patterns 1a projects outward from an end 12 of each plane of the circuit pattern 1a, which contacts the ceramic board 1, and the encapsulation resin 4 also fills the under cut parts 1aa. 【課題】本発明は半導体装置の小型化と信頼性の向上を低コストで両立させた半導体装置およびその製造方法の提供を目的とする。【解決手段】本発明に係る半導体装置は、セラミック基板１と、セラミック基板１表面に配置された複数の回路パターン１ａと、少なくとも１つの回路パターン１ａの表面に配置された半導体素子２と、セラミック基板１、複数の回路パターン１ａおよび半導体素子２を封止する封止樹脂４と、を備え、隣接する回路パターン１ａの対向する側面にはアンダーカット部１ａａが形成され、アンダーカット部１ａａにおいて、回路パターン１ａのセラミック基板１に接する面の端部１２よりも、回路パターン１ａの表面の端部１１の方が当該回路パターン１ａの外側に突出しており、アンダーカット部１ａａにも封止樹脂４が充填されることを特徴とする。【選択図】図１