CONDUCTIVE STRUCTURE AND METHOD OF PRODUCING THE SAME

• Main Authors: SUZUKI TAKESHI, WAKUDA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 13.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; CONDUCTORS; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a conductive structure which makes it possible to reliably form a conductive path even for a complex and narrow wiring pattern, and has excellent flex resistance, and a method of producing the same.SOLUTION: A conductive structure comprises a substrate, a conductive part having a binder part provided on the substrate and conductive fiber included in the binder part, and an encapsulation part covering the conductive part. Part of the conductive fiber projects from the inside of the tapered binder part to the inside of the encapsulation part. 【課題】複雑で狭小な配線パターンであっても、確実に導電パスが形成できると共に、耐屈曲性にも優れた導電性構造体、およびその製造方法を提供すること。【解決手段】本発明は、基板、基板上に設けられたバインダー部およびバインダー部内に内在する導電性繊維を有して成る導電部、および導電部を覆う封止部を備えた導電性構造体であって、導電性繊維の一部が、テーパー状のバインダー部内から封止部内に突出していることを特徴とする。【選択図】図１