SUBSTRATE CLEANING APPARATUS AND METHOD, AND RECORDING MEDIUM

• Main Authors: TAKIGUCHI YASUSHI, KYODA HIDEJI, MUTA KOSHI, YAMAMOTO TARO
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2015
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

PROBLEM TO BE SOLVED: To reduce a size of a substrate cleaning apparatus that cleans a back surface of a wafer W as a substrate, and increase cleaning capability of substrate cleaning processing.SOLUTION: A substrate cleaning apparatus includes first and second cleaning members 6A and 6B that clean a central region of a back surface side of a wafer W being held by a suction pad 2 and moving in a horizontal direction, and clean a peripheral edge region of the back surface of the wafer W being held by a spin chuck 3. The first and second cleaning members 6A and 6B are provided, allowing cleaning capability to be increased compared with a case of a single cleaning member. Further, the first and second cleaning members 6A and 6B are configured to rotate in a horizontal direction by a common rotating shaft 52, and the rotating shaft 52 is arranged so as to be overlapped with the wafer W when the central region of the back surface of the wafer W is cleaned. Since the rotating shaft 52 is installed using a movement region of the wafer W, the apparatus can be reduced in size. 【課題】基板であるウエハＷの裏面を洗浄する基板洗浄装置の小型化を図ると共に、基板洗浄処理の洗浄力を高めること。【解決手段】ウエハＷを吸着パッド２に保持して水平方向に移動しているときに、ウエハＷの裏面側の中央領域を洗浄し、ウエハＷがスピンチャック３に保持されているときに、ウエハＷの裏面の周縁領域を洗浄する第１及び第２の洗浄部材６Ａ、６Ｂを設ける。このように第１及び第２の洗浄部材６Ａ、６Ｂを設けているので、洗浄部材が単独である場合に比べて洗浄力を高くすることができる。また第１及び第２の洗浄部材６Ａ、６Ｂは共通の旋回軸５２により各々水平方向に旋回するように構成されているが、ウエハＷ裏面の中央領域を洗浄するときにはて旋回軸５２はウエハＷに重なって位置するように配置される。旋回軸５２はウエハＷの移動領域を利用して設置されるので、装置の小型化が図られる。【選択図】図１