METHOD OF PRECURSOR SUBSTRATE, METHOD OF PRODUCING FLEXIBLE PRINTED WIRING BOARD AND PRECURSOR SUBSTRATE

• Main Authors: HSIAO CHIHNG, CHIU CHIEN-HWA, CHAO CHIH-MIN, KUO PEIR-RONG, GUAN FENGPING, CHIANG CHIA-HUA, LEE YING-WEI, LEE WEING
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a precursor substrate, a flexible printed wiring board, and a method of producing the same which improves problems of difficulty in plating a precursor substrate with a metal conductive layer and reduces the time for production and costs.SOLUTION: There is provided a method of producing a precursor substrate includes: a step of preparing a substrate, a step of forming a catalyst layer on the substrate by catalyzing the surface with a catalyst; a step of fixing a conductive layer onto the surface of the catalyst layer by forming a conductive layer binding to the catalyst layer; and a step of forming a precursor substrate by plating the conductive layer entirely with a metal layer. And also provided is a precursor substrate including at least a substrate having a surface serving as a catalyzed surface and a catalyst layer on the catalyzed layer, a conductive layer coated with the surface by binding to the catalyst layer, and a metal layer located on the surface of the conductive layer. 【課題】前駆基板に金属導電層をメッキしにくく、製造が容易ではない問題を改善し、生産にかかる時間、費用コストを節約する前駆基板、フレキシブルプリント配線基板及びその製造方法を提供すること。【解決手段】本発明は、基板を用意する工程と、前記基板の表面を触媒で触媒化することにより、前記基板に触媒層を形成する工程と、前記触媒層と結合する導電層を形成することにより、前記導電層を前記触媒層の表面に固着する工程と、金属層を前記導電層に全面的にメッキすることにより、前駆基板を形成する工程とを少なくとも含む前駆基板の製造方法を提供する。さらに、本発明は、触媒化された表面である表面を有し、前記触媒化された表面に触媒層が含まれる基板と、前記触媒層に結合されることで前記表面に被覆される導電層と、前記導電層の表面に位置する金属層とを少なくとも含む前駆基板を提供する。【選択図】図２Ｅ