SHEET-LIKE STRUCTURE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING SHEET-LIKE STRUCTURE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

• Main Authors: HIROSE SHINICHI, YAMAGUCHI YOSHITAKA, WAKANA SHINICHI, NORIMATSU MASAAKI, ASANO TAKAHARU, SAKIDA YUKIE, MIZUNO YOSHIHIRO, SAKUYAMA SEIKI, YAGISHITA YOHEI
• Format: Patent
• Language: English; Japanese
• Published: 06.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a sheet-like structure reduced in contact thermal resistance.SOLUTION: A sheet-like structure 10 includes: a bundle-like structure 13 having a plurality of linear structures 11 of carbon element which are oriented in a predetermined direction; a first filling layer 14 which has a second thickness in the predetermined direction thinner than a first thickness in the predetermined direction of the bundle-like structure 13 and is filled between the plurality of linear structures 11 of carbon element; a second filling layer 15 which is filled between the plurality of linear structures 11 of carbon element in the bundle-like structure 13 and is formed of a thermosetting adhesive; and a bonding layer which is disposed between the first filling layer 14 and the second filling layer 15 and bonds the first filling layer 14 and the second filling layer 15 together. The first filling layer has higher flexibility than the second filling layer. 【課題】接触熱抵抗の低減されたシート状構造体を提供する。【解決手段】シート状構造体１０は、所定の方向に配向した複数の炭素元素の線状構造体１１を有する束状構造体１３と、束状構造体１３の所定の方向の第１の厚さよりも薄い所定方向の第２の厚さを有し、複数の炭素元素の線状構造体１１の間に充填される第１充填層１４と、束状構造体１３における複数の炭素元素の線状構造体１１の間に充填され熱硬化性接着剤により形成される第２充填層１５と、第１充填層１４と第２充填層１５との間に配置され、第１充填層１４と第２充填層１５とを接合する接合層と、を備え、第１充填層は第２充填層よりも高い柔軟性を有する。【選択図】図１