INSULATING SUBSTRATE ELECTROSTATIC INK JET PRINT HEAD

PROBLEM TO BE SOLVED: To provide an electrostatic ink jet print head which can be produced at a low cost by combining the lower cost of chip-on-glass with the high efficiency of MEMS technologies.SOLUTION: An insulating substrate print head 70 has: an insulating substrate 72; a conductive layer 74 o...

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Bibliographic Details
Main Author DAVID L KNIERIM
Format Patent
LanguageEnglish
Japanese
Published 23.10.2014
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Summary:PROBLEM TO BE SOLVED: To provide an electrostatic ink jet print head which can be produced at a low cost by combining the lower cost of chip-on-glass with the high efficiency of MEMS technologies.SOLUTION: An insulating substrate print head 70 has: an insulating substrate 72; a conductive layer 74 on the insulating substrate 72, the conductive layer 74 including interconnect patterns and actuation pads corresponding to each of an array of jets; an insulating layer 76 on the conductive layer 74; a membrane 78 attached to the insulating layer 76, and a jet stack attached to the membrane 78. 【課題】より費用が低いチップ・オン・グラスを効率の高いMEMS技術と組み合わせて、低い費用で製造することが可能な静電インクジェットプリントヘッドの提供。【解決手段】絶縁基板プリントヘッド70は、絶縁基板72と、絶縁基板72上の導電層74であって、導電層74はジェットのアレイの各々に対応する相互接続パターンおよびアクチュエーションパッドを含む、導電層74と、導電層74上の絶縁層76と、絶縁層76に取り付けられている膜78と、膜78に取り付けられているジェットスタックとを有する。【選択図】図2
Bibliography:Application Number: JP20140048160