SEMICONDUCTOR DEVICE

• Main Authors: YOSHIMOTO TAKAHIRO, SASAI TAKUMA, SUMIYA HARUHIKO, FUJIMOTO YOSHIHISA
• Format: Patent
• Language: English
• Published: 20.01.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To simultaneously prevent outflow of heat conduction grease applied between a semiconductor module and a heat sink and mixing of air into an application space by repetitive thermal curvature deformation of the semiconductor module due to exothermic heat and ambient temperature...