PACKAGE MOLDING FOR LIGHT EMITTING DEVICE

• Main Authors: KASAE NOBUHIDE, SENAO KEISUKE
• Format: Patent
• Language: English
• Published: 08.08.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a package molding which enables a light emitting component to be self-aligned and mounted and inhibits the leakage of a sealing resin, sealing the light emitting component, to a rear surface of the package molding.SOLUTION: A package molding of this invention has: a resin molding having a recessed part for housing a light emitting component; and a first lead and a second lead which are spaced away from each other and are exposed on a bottom surface of the recessed part of the resin molding and a rear surface of the resin molding. An exposed surface of the first lead has a first edge part and a second edge part which face each other sandwiching a placement region of the light emitting component in a first direction and includes a first cutout part filled with the resin molding and located at the first edge part. An inner side surface of the recessed part of the resin molding contacts with the first edge part. The recessed part of the resin molding has a protruding part protruding from the inner side surface toward the recessed part. The protruding part partially covers the first cutout part excluding a top part. A dimension of the placement region of the light emitting component, which is measured in the first direction, is equal to or longer than a distance between the top part of the first cutout part and the second edge part and is shorter than a distance between the protruding part and the second edge part.