BROKEN WAFER RECOVERY SYSTEM
PROBLEM TO BE SOLVED: To provide an apparatus and method for recovery and cleaning, especially beneficial for fabrication systems using silicon wafer carried on trays.SOLUTION: A broken substrate removable system for use in a substrate processing system is provided, comprising: a suction head 362 ha...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
13.12.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!