BROKEN WAFER RECOVERY SYSTEM

PROBLEM TO BE SOLVED: To provide an apparatus and method for recovery and cleaning, especially beneficial for fabrication systems using silicon wafer carried on trays.SOLUTION: A broken substrate removable system for use in a substrate processing system is provided, comprising: a suction head 362 ha...

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Bibliographic Details
Main Authors CRAIG LYLE STEVENS, BRANIGAN WENDELL THOMAS, BERKSTRESSER DAVID ERIC
Format Patent
LanguageEnglish
Published 13.12.2012
Subjects
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