BROKEN WAFER RECOVERY SYSTEM

PROBLEM TO BE SOLVED: To provide an apparatus and method for recovery and cleaning, especially beneficial for fabrication systems using silicon wafer carried on trays.SOLUTION: A broken substrate removable system for use in a substrate processing system is provided, comprising: a suction head 362 ha...

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Bibliographic Details
Main Authors CRAIG LYLE STEVENS, BRANIGAN WENDELL THOMAS, BERKSTRESSER DAVID ERIC
Format Patent
LanguageEnglish
Published 13.12.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an apparatus and method for recovery and cleaning, especially beneficial for fabrication systems using silicon wafer carried on trays.SOLUTION: A broken substrate removable system for use in a substrate processing system is provided, comprising: a suction head 362 having an inlet; a placing mechanism 364, 366 for moving the suction head to a location of the broken substrate 372; a suction pump 365; and a flexible hose 368 coupling the suction head to the suction pump. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor.
Bibliography:Application Number: JP20120117853