WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Authors: SATO HIRONORI, HIGO ICHIEI, YAMADA ERINA
• Format: Patent
• Language: English
• Published: 05.07.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board including a conductor post which deals with high density assembly, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 10 includes a conductor layer 12, a solder resist layer 13 laminated on the conductor layer 12, and a...